LASER MARKING APPARATUS OF SEMICONDUCTOR WAFER

摘要

PURPOSE: A laser marking apparatus for a semiconductor wafer is provided to effectively remove particles from a semiconductor wafer by enlarging the spray hole of the air nozzle. CONSTITUTION: A laser marking apparatus has a laser source(120) inscribed with an indicator for discriminating a semiconductor wafer(100). An air nozzle(130) is placed over the semiconductor wafer(100) to remove particles(150) generated from the semiconductor wafer(100) during the inscription process by way of the laser source(120). An absorption member(140) prevents the particles(150) detached by way of the air nozzle(130) from being reattached to the semiconductor wafer(100). The diameter of the spray hole of the air nozzle(130) is larger than the diameter of the wafer discrimination indicator. The spray hole of the air nozzle(130) has a diameter ranged from 1cm¬2 to 3cm¬2. The spray hole of the air nozzle(130) and the absorption hole of the absorption member(140) are placed at the same rectilinear line.