发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide conductive paste having specific resistance and adhesion strength showing values equal to or almost comparable to those of an electrode formed of elemental Ag and improved in migration-resistance at a low cost. SOLUTION: The purpose is accomplished by conductive paste characterized by containing a binder resin, Ag powder and at least one kind of metal or compound of metal selected from a group comprising Ti, Ni, In, Sn and Sb.
申请公布号 JP2003115216(A) 申请公布日期 2003.04.18
申请号 JP20020209269 申请日期 2002.07.18
申请人 TORAY IND INC 发明人 SANADA JUNJI;NOBUMASA HITOSHI
分类号 H05K3/12;H01B1/22;(IPC1-7):H01B1/22 主分类号 H05K3/12
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