发明名称 |
METHOD FOR CUTTING HEAT-DEVELOPABLE PHOTOSENSITIVE MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for cutting a heat-developable photosensitive material, in which a film peeling does not take place at the edges of a section when a continuously running long heat-developable photosensitive material is cut every prescribed length by working a die set comprising upper and lower blades. SOLUTION: The method for cutting a heat-developable photosensitive material is a sheet cutting method in which a continuously running long photosensitive material is cut every prescribed length by working a die set comprising upper and lower blades to continuously produce sheetlike photosensitive materials, and it is characterized in that the sheetlike photosensitive materials are heat-developable photosensitive materials not strengthened by an undercoat layer and having an imaging layer prepared using an organic solvent and cutting is carried out under such a temperature condition that the surface temperature of at least one of the upper and lower blades and/or the imaging layer is between a temperature below the Tg (glass transition temperature) of the imaging layer and a temperature of (the Tg) -30 deg.C or below.
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申请公布号 |
JP2003114493(A) |
申请公布日期 |
2003.04.18 |
申请号 |
JP20020206661 |
申请日期 |
2002.07.16 |
申请人 |
KONICA CORP |
发明人 |
TANAHASHI SEIICHI;MITSUTAKE HITOSHI;KANEKO TAKESHI |
分类号 |
G03C1/498;B26D3/00;(IPC1-7):G03C1/498 |
主分类号 |
G03C1/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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