METHOD FOR ENCAPSULATING AN ELECTRICAL COMPONENT AND SURFACE WAVE COMPONENT THUS ENCAPSULATED

摘要

An encapsulating method for sensitive components is disclosed, in which a film, in particular a plastic film is laminated over the whole surface of an arrangement with a flip-chip style component mounted on a support. A plastic mass is then applied around the chip in liquid form and hardened to achieve further sealing and mechanical stability. The film can optionally be removed along structuring lines before the application of the plastic mass such that the plastic mass can be brought into contact with the support as well as the chip surface.