发明名称 Electrical coupling of substrates by conductive buttons
摘要 A structure and method for electrically coupling two substrates (e.g., a printed wiring board and an electronic module). Initially, a dielectric core is provided. A conductive wiring is helically wound circumferentially around the dielectric core. Additionally, a dielectric jacket may be formed around the conductive wiring. The resultant conductive rod structure is cut axially along the length of the conductive rod to generate conductive buttons having end contacts. The end contacts of the conductive buttons may be used to electrically couple the two substrates at corresponding pads of the two substrates.
申请公布号 US2003073329(A1) 申请公布日期 2003.04.17
申请号 US20010975213 申请日期 2001.10.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BEAMAN BRIAN S.;BRODSKY WILLIAM L.;BUSBY JAMES A.;CHAN BENSON;MARKOVICH VOYA R.;PERRY CHARLES H.
分类号 H01R12/04;H01R13/24;H01R43/00;(IPC1-7):H05K1/00 主分类号 H01R12/04
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