发明名称 Heat sink module
摘要 A heat sink module has a heat dissipation performance by a thermal conducting tube with a vacuum and a cooling fluid therein. The thermal conducting tube corresponds to a center of a CPU, so most of the heat from the CPU is able to be dissipated quickly to keep the CPU in a normal operating temperature range.
申请公布号 US2003070791(A1) 申请公布日期 2003.04.17
申请号 US20010976951 申请日期 2001.10.12
申请人 LIN YU-SHEN 发明人 LIN YU-SHEN
分类号 H01L23/427;(IPC1-7):F28D15/00 主分类号 H01L23/427
代理机构 代理人
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