发明名称 |
Semiconductor device and structure for mounting the same |
摘要 |
A semiconductor device which includes a semiconductor chip, an insulating film formed on the semiconductor chip, a plurality of projected stress relaxation materials formed on the insulating film, projected electrodes covering at least tops of the stress relaxation materials, and wiring lines for electrically connecting the projected electrodes and element electrodes of the semiconductor chip.
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申请公布号 |
US2003071331(A1) |
申请公布日期 |
2003.04.17 |
申请号 |
US20020271572 |
申请日期 |
2002.10.17 |
申请人 |
YAMAGUCHI YOSHIHIDE;TSUNODA SHIGEHARU;TENMEI HIROYUKI;HOZOJI HIROSHI;KANDA NAOYA |
发明人 |
YAMAGUCHI YOSHIHIDE;TSUNODA SHIGEHARU;TENMEI HIROYUKI;HOZOJI HIROSHI;KANDA NAOYA |
分类号 |
H01L21/66;H01L21/56;H01L21/60;H01L23/12;H01L23/485;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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