Semiconductor device

摘要

In a semiconductor device for treating signals of frequency not less than 800 MHz, a minimum thickness of an electrically conductive wire connecting a semiconductor electric circuit in the semiconductor device to an electric member other than the semiconductor device is determined along the following formula: 1 $2*\sqrt{\frac{2}{\omega itit\mathrm{mu}itit\kappa }}<h$ when h is the minimum thickness of the electrically conductive wire, kappa is an electrical conductivity of the electrically conductive wire, mu is a magnetic permeability of the electrically conductive wire, omega is an angular frequency of the signals transmitted through the electrically conductive wire.