| 摘要 |
<p>A multilayer wiring board (1) has a laminate structure including insulating layers (20, 30) and a wiring layer (40). The method for manufacturing the multilayer wiring substrate (1) comprises the step of bonding a support film having a metallic contact layer (50) to the insulating layer (20) through the metallic contact layer (50) the step of removing the support film while transferring the metallic contact layer (50) to the insulating layer (20) the step of forming the wiring layer (40) by forming a resist pattern on the metallic contact layer (50) and forming a plating film on an unmasked area of the resist pattern, and the step of removing the resist pattern and the metallic contact layer (50) which is not covered with the wiring layer (40).</p> |
