| 摘要 |
<p>A photosensitive resin composition which comprises (A) a resin prepared by providing a phenolic novolac and/or cresolic novolac modified bis-phenol type epoxy resin, subjecting the epoxy group of the epoxy resin to an addition reaction with an unsaturated monobasic acid, to give a reaction product (I), and further subjecting the hydroxyl group of the reaction product to an addition reaction with a saturated and/or unsaturated polybasic acid anhydride, (B) an epoxy resin, (C) a photopolymerization initiator and (D) a polymerizable unsaturated compound and/or a solvent. The photosensitive resin composition is particularly excellent in the developability with an aqueous dilute alkaline solution and is capable of forming a cured coating film which is excellent particularly in flexibility, heat resistance, soldering heat resistance, adhesion, water resistance, bending resistance, chemical resistance and the like.</p> |
