Manufacturing method for data carrier with embedded coil structure uses rear equalisation structure for pushing coil structure into openings in overlying equalisation layer

摘要

The method has the coil structure applied to a core layer (11) and overlaid by an equalisation layer (12) with openings (12b) corresponding to the coil structure, the rear side of the core layer provided with an equalisation structure (15) corresponding to these openings, before lamination between lower and upper outer layers (13,14). An Independent claim for a portable data carrier with an embedded coil structure is also included.