| 摘要 |
A heat sink assembly for use with edge connectors, e.g., card edge connectors, of cards or printed circuit boards. The heat sink assembly provides a relatively large heat transfer capacity to control temperatures in contacts of the edge connectors which increases the current rating of the connector by allowing more current to pass through the connector. The heat sink assembly includes fins attached to the edge connector power and ground leads by direct thermal connection, such as soldering, to traces in the board. The fins are connected to the power and ground leads in an alternating or interweaved fashion. The fins are fabricated from thermal conducting material and heat is conducted to the fins where it is removed by the relatively large surface area of the fins. Adjacent fins are electrically isolated such that power and ground fins do not contact.
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