| 发明名称 |
Plastic film for integrated circuit boards comprises vertical metal wires which connect an integrated circuit to a conductor plate via soldered joints |
| 摘要 |
<p>A plastic film comprises vertical metal wires which connect an integrated circuit to a conductor plate via soldered joints. The plastic film consists of silicone rubber and has a temperature resistance of 300 +- 50[deg]C, an elasticity of 60 +- 20 Shore and a thickness of 0.6 +- 0.3 mm.</p> |
| 申请公布号 |
DE20300336(U1) |
申请公布日期 |
2003.04.17 |
| 申请号 |
DE2003200336U |
申请日期 |
2003.01.10 |
| 申请人 |
GEYER, STEFAN |
发明人 |
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| 分类号 |
H01L21/60;H01L23/498;H05K3/34;H05K3/40;(IPC1-7):H05K1/02;H01L21/58 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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