发明名称 |
Semiconductor device |
摘要 |
It is the object of the present invention to provide a semiconductor device capable of ensuring bonding strength without applying an excessive stress to solder balls and having a high degree of reliability. A substrate made of metal for the purposes of making an electric wiring circuit and taking heat radiation into account has recessed portions on one surface opposite to the other surface to which solder balls are bonded.
|
申请公布号 |
US2003071353(A1) |
申请公布日期 |
2003.04.17 |
申请号 |
US20020300774 |
申请日期 |
2002.11.21 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
NOGUCHI TAKASHI |
分类号 |
H01L23/12;H01L21/68;H01L23/00;H01L23/13;H01L23/31;H01L23/34;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/12 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|