BUMP JOINING JUDGING DEVICE AND METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION DEVICE AND METHOD

摘要

When electrodes (13) on an electronic component (150) and electrode portions (21) on a circuit board (20) are joined via bumps (11, 12) with the electronic component and the circuit board vibrated respectively, a vibration damping detect device (140) and a deciding device (141) detect damping of the vibration caused by a progress of joining between the bumps and the electrode portions, and then determine a good or defective of the joining on a basis of the damping of the vibration. Further, regarding an impedance of an ultrasonic oscillator (133), a movement amount of a nozzle (93), or a current supplying to a VCM (121), these waveforms during the joining are compared with waveforms of good joining thereof and then the good or defective is determined. According to the above constructions, the good or defective of the joining between the electronic component and the circuit board can be determined during the joining. Further, when a joining state becomes wrong during the joining, the joining state can be changed. Thus generation of defective components is prevented and a yield can be improved.