发明名称 STACK PACKAGE USING FLEXIBLE DOUBLE WIRED SUBSTRATE
摘要 PURPOSE: A stack package using a flexible double wired substrate is provided to reduce an error rate of the stack package by using a base package and unit packages in a reliable manner. CONSTITUTION: A stack package includes a base package(200), and unit packages(300) three-dimensionally deposited on the base package(200). The base package(200) has a plurality of contact terminals(160). The first and the second unit packages(300a,300b) are formed on the base package(200). The first unit package(300a) has a side contacting the contact terminals of the base package(200), and an opposite side with first contact terminals(260a) electrically connected to the contact terminals(160) of the base package(200). The second unit package(300b) has a side contacting the first contact terminals(260a) of the first unit package(300a), and an opposite side with second contact terminals(260b) electrically connected to the first contact terminals(260a).
申请公布号 KR20030029743(A) 申请公布日期 2003.04.16
申请号 KR20010062435 申请日期 2001.10.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, SIN
分类号 H01L23/14;H01L23/02;H01L23/31;H01L23/34;H01L23/48;H01L23/498;H01L25/10;H01L29/40 主分类号 H01L23/14
代理机构 代理人
主权项
地址