| 摘要 |
A curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as a 1,3-diallyl-5-glycidylisocyanurate, and an ultraviolet-ray absorbing agent such as a 2-[2-hydroxy-3,5-bis(alpha,alpha-dimethylbenzyl)phenyl]benzotriazole. A film is obtained from the curable composition by a solution casting method, is laminated on an inner-layer board and is cured to obtain a multi-layer circuit board.
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