| 发明名称 |
A method of soldering |
| 摘要 |
<p>In a method of soldering the surfaces of a component (11) to a substrate (12), a solder preform (15) is located in the gap between the surfaces. The solder is heated and an over pressure applied to move the surfaces together whilst the solder is molten. Abutments (17) between the surfaces limit the spacing between them. A trapped void (18) is decreased in volume as the pressure is applied. The method is particularly applicable to monolithic microwave integrated circuits (MMIC) and reduces void areas in joints.</p> |
| 申请公布号 |
GB2372473(B) |
申请公布日期 |
2003.04.16 |
| 申请号 |
GB20010004577 |
申请日期 |
2001.02.24 |
| 申请人 |
* MARCONI CASWELL LIMITED;* MARCONI OPTICAL COMPONENTS LIMITED;* BOOKHAM TECHNOLOGY PLC |
发明人 |
KEVIN JOSEPH * LODGE;GILES * HUMPSTON;JAMES HUGH * VINCENT |
| 分类号 |
B23K35/02;B23K35/14;B23K35/26;B23K35/30;H01L21/60;H01L29/06;H05K3/34;(IPC1-7):B23K35/02 |
主分类号 |
B23K35/02 |
| 代理机构 |
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