Wafer cleaning device, wafer cleaning method and chemical mechanical polishing machine

摘要

A wafer cleaning device is provided with a roll brush extending in an axial direction and having an end portion supported so that the roll brush can be rolled around its axis freely for performing cleaning by touching a rolled contact surface of the roll brush to a cleaned surface of a wafer. The end portion of the roll brush is supported so that the roll brush can be displaced by a dial adjusting screw to enable the axis to be tilted to the cleaned surface of the wafer.