发明名称 REMOVABLE ELECTRONIC SUBASSEMBLY WITH A COMPRESSIBLE SHOCK ABSORBING DEVICE
摘要 A removable electronic subassembly is designed for placement into a data processing system which requires said removable electronic subassembly to fi t into an aperture defining a selected form factor. The removable electronic subassembly comprises a rigid enclosure which encloses interior components o f the removable electronic subassembly. The rigid enclosure has exterior dimensions which are smaller than the selected form factor. A layer of resilient material is mounted to an exterior of the rigid enclosure. The lay er of resilient material and the rigid enclosure have at least one exterior dimension which exceeds the selected form factor in an uncompressed state wherein the resilient material may be compressed such that the at least one exterior dimension conforms to the selected form factor.
申请公布号 CA2208045(C) 申请公布日期 2003.04.15
申请号 CA19952208045 申请日期 1995.12.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 NAGARAJAN, SUBRAHMANYAN
分类号 B42D15/10;G06F1/16;G11B25/04;G11B33/02;G11B33/08;G11B33/12;H05K5/02;(IPC1-7):H05K7/10 主分类号 B42D15/10
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