| 摘要 |
An apparatus for controlling the temperature, during testing, of IC devices formed on a wafer includes a chuck for locating the devices during testing and multiple temperature control devices arranged on the chuck to correspond with the arrangement of the devices being tested on the wafer. The chuck itself can be cooled or heated, such as by the flow of a temperature-controlled fluid, and a temperature control device such as a heating element can be associated with each IC device being tested. Alternatively, a separate heat sink can be associated with each temperature control device and its corresponding IC device.
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