发明名称 Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
摘要 A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
申请公布号 US6547638(B2) 申请公布日期 2003.04.15
申请号 US20010804232 申请日期 2001.03.13
申请人 发明人
分类号 B08B1/04;B24B27/00;B24B37/04;B24B51/00;B24B55/12;F24F3/16;H01L21/00;H01L21/677;H03M13/39;H04L1/00;H04N5/44;H04N5/455;(IPC1-7):B24B51/00 主分类号 B08B1/04
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