发明名称 Method for fabricating semiconductor capacitor
摘要 A method of fabricating a semiconductor capacitor is disclosed. An impurity layer is formed on a semiconductor substrate. An interlayer insulating film is disposed on an upper surface of the impurity layer and the semiconductor substrate. A contact hole is selectively etched through the interlayer insulating film to the impurity layer. A conductive plug is formed in the contact hole. A metal film pattern having an irregular surface area is disposed on the conductive plug. A dielectric substance film is located directly on the irregular surface of the metal film pattern. A metal electrode is formed on the dielectric substance film.
申请公布号 US6548351(B2) 申请公布日期 2003.04.15
申请号 US20010767263 申请日期 2001.01.23
申请人 HYUNDAI ELECTRONICS INDUSTRIES CO., LTD. 发明人 HWANG SOON-HONG
分类号 H01L21/108;H01L21/02;H01L21/8242;(IPC1-7):H01L21/824 主分类号 H01L21/108
代理机构 代理人
主权项
地址