| 摘要 |
A novel apparatus for manufacturing Solid-Solder-Deposit Printed Circuit Boards (SSD-PCBs) by melting solder powder via induction heating consequently forming relatively thick layers of solid solder over the soldering pads of a bare-PCB 230. Solid Solder Deposit (SSD) refers to a relatively thick layer of solid solder metallurgically bonded over the soldering pads of a bare-PCB 230 such as that said SSD-PCB by itself is the source for solder alloy during a subsequent soldering operation. The manufacture of SSD-PCBs provides the electronic assembly industry with ready-to-solder PCBs consequently eliminates the need to use solder paste at the assembly floor. This invention, unlike the prior art for producing SSD-PCBs, utilizes a solder powder pile 232 that is melted by localized electromagnetic induction heating. Specifically my invention reduces the manufacturing cost, shorten manufacturing time, reduce manufacturing energy consumption and improves SSD-PCBs' quality and reliability while requiring less manufacturing equipment than prior art.
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