| 发明名称 |
Low cost electroless plating process for single chips and wafer parts and products obtained thereof |
| 摘要 |
The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
|
| 申请公布号 |
US6548327(B2) |
申请公布日期 |
2003.04.15 |
| 申请号 |
US20010841359 |
申请日期 |
2001.04.24 |
| 申请人 |
INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM, VZW;UNIVERSITEIT GENT |
发明人 |
DE PAUW HERBERT;VANFLETEREN JAN;ZHANG SUIXIN |
| 分类号 |
H01L21/288;H01L21/60;H01L21/68;H01L23/485;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/288 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
