发明名称 |
VERFAHREN, ANLAGE UND VORRICHTUNG ZUR HERSTELLUNG EINES ELEKTRISCHEN VERBINDUNGSELEMENTES SOWIE ELEKTRISCHES VERBINDUNGSELEMENT UND HALBZEUG |
摘要 |
The production method has a plastically deformable substrate provided with recesses corresponding to required conductor paths via an embossing tool, before coating with a thin conductive layer and galvanic deposition of a conductive material until the recesses are filled. The conductive material is then selectively removed via etching, so that only the required conductive areas remain. Also included are Independent claims for the following: (a) an electrical connecting element; (b) a semi-finished product for an electrical connecting element; (c) an electrical connecting element manufacturing plant; (d) a device for embossing a plastically deformable substrate |
申请公布号 |
AT235795(T) |
申请公布日期 |
2003.04.15 |
申请号 |
AT20010900010T |
申请日期 |
2001.01.04 |
申请人 |
ELMICRON AG |
发明人 |
WALZ, SILKE;STEIERT, PHILIPPE;SCHMIDT, WALTER |
分类号 |
G06K19/077;H01L23/12;H01L23/32;H05K1/00;H05K1/16;H05K1/18;H05K3/00;H05K3/04;H05K3/10;H05K3/22;H05K3/24;H05K3/42;H05K3/46;(IPC1-7):H05K3/10 |
主分类号 |
G06K19/077 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|