发明名称 CPU cooling device using thermo-siphon
摘要 A hollow evaporator is disposed in contact with the upper surface of the CPU. Heat from the CPU is absorbed by the evaporation of the refrigerant. The vaporized refrigerant ascends through the vapor flow channel by convection, flows into a condenser located above the evaporator, and radiates heat to be liquefied. The liquefied refrigerant flows down by its own weight through the liquid flow channel and returns to the evaporator. This circulation is repeated in this manner.
申请公布号 US6549408(B2) 申请公布日期 2003.04.15
申请号 US20010992751 申请日期 2001.11.16
申请人 GLOBAL COOLING BV 发明人 BERCHOWITZ DAVID M.
分类号 F25D9/00;F25B9/14;F28D15/02;G06F1/20;H01L23/427;H05K7/20;(IPC1-7):H05K7/20 主分类号 F25D9/00
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