| 摘要 |
A semiconductor chip assembly includes a semiconductor chip, a conductive trace, an insulative adhesive and a hardened connection joint. The conductive trace includes first and second opposing surfaces and a peripheral sidewall between the surfaces, the first surface faces away from the pad and the peripheral sidewall overlaps the pad. The adhesive is between the second surface and the pad. The connection joint contacts the first surface, the peripheral sidewall and the pad, extends between the peripheral sidewall and the pad and electrically connects the conductive trace and the pad. Preferably, the connection joint is reflowed solder or cured conductive adhesive. A method of manufacturing the assembly includes disposing the adhesive between the conductive trace and the pad, then etching the adhesive thereby exposing the pad, then depositing a non-solidified material on the first surface, the peripheral sidewall and the pad, and then transforming the non-solidified material into the connection joint.
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