| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that air being mixed in resin remains in a fine pattern when a number of semiconductor devices are subjected to common molding in a CSP-type semiconductor device and at the same time one-time transfer mold process in a manufacturing method of the semiconductor device before. SOLUTION: In the manufacturing method of semiconductor devices, a through hole 42 is provided on the opposite surface of a gate 383 in a die 38 to remove air that is mixed in resin in a transfer mold process, thus sending away the air that is mixed in the resin in transfer mold to the through hole 42 for removal to the outside of the mold 38, and hence flatly forming the back of a semiconductor device 21 merely by the transfer mold process. |
