DEVICE AND METHOD FOR SMOOTHING WAFER FOR BONDING BY CHEMICAL MECHANICAL POLISHING (CMP)

摘要

PROBLEM TO BE SOLVED: To provide a method and device by which a semiconductor substrate, a CMP tool, a brush cleaning tool, and a chemical wafer cleaning tool can be incorporated. SOLUTION: CMP is performed with a descending force of 1 psi, backward air pressure of 0.5 psi, platen speed of 50 rpm, carrier speed of 30 rpm, and slurry flow rate of 140 milliliter.