| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board capable of responding to miniaturization of wiring by disclosing a method of forming a via hole having high levels of adhesion, electrical characteristics, and connection reliability in a circuit board having electrically conductive layers serving as circuit patterns on both sides of an insulating layer, and to provide a new manufacturing method which does not increase the work hour in proportion to the hole count as in conventional works and which can respond to future miniaturization and higher wiring density. SOLUTION: This circuit board has a filled via of a multistage rivet type structure as shown in figure 1 (i), wherein the circuit substrate has a first electrically conductive layer and a second electrically conductive layer, which are separated by an insulating layer. This method of manufacturing the circuit substrate forms the via hole with a photographic method throughout. |
