THERMAL CONDUCTION SHEET AND ITS PRODUCING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a thermal conduction sheet, and its producing method, exhibiting high heat dissipation properties to a semiconductor element while suppressing cracking or stripping from the semiconductor element. SOLUTION: The thermal conduction sheet exhibiting excellent heat dissipation properties while suppressing cracking or stripping after being integrated with a semiconductor element can be produced through combination of a resin sheet (sheet-like resin basic material 2) and a thermally conductive wire (thermal conduction path 1).