| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device enabling to reduce degradation by permeating moisture or transmitting oxygen, for example, a light-emitting device having an OLED formed on a plastic board, or a liquid crystal display device using a plastic board. SOLUTION: After a peel-off layer containing an element is formed on a board, the peel-off layer is adhered to a support body and the peel-off layer is peeled off from the board, a thin film in contact with the peel-off layer is formed, and then, is bonded to a transfer body 22. In so doing, a crack generated at peeling is repaired, and by using a film 20 having heat conductance as a thin film contacting the peel-off layer, in particular, a nitride of aluminum or oxide nitride of aluminum, heat generation of the element is diffused, which has the effect of protecting the transfer body 22, in particular, the plastic board from deformation or deterioration.
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