| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that peeling is apt to occur to a metalized layer for sealing, resulting in reduction of reliability of airtight sealing of a package. SOLUTION: A package for containing an electronic part 3 is formed such that an electronic part 3 is airtightly sealed between package base body 1 and a metal cover body 2 by joining the metal cover body 2 with a metalized layer 9 for sealing of the package base body 1. A ceramic frame body 6 having an upper surface the whole surface of which is covered by the metalized layer 9 for sealing is laminated on a flat plate-form ceramic substrate 5 having a loading part 4, on the upper surface of which the electronic part 3 is loaded, through a brazing filler metal. The package for containing an electronic part is formed that the metalized layer 9 for sealing constituted that the thickness of a portion with which the metal cover body 2 is joined is 15-50μm and a thin part 9a with thickness of 5-10μm is situated in width of 0.05-0.2 mm from an outer peripheral edge. Stress is excellently dispersed at the thin part 9a and the metalized layer 9 for sealing is effectively prevented from peeling from the ceramic frame body 6.
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