发明名称 PLASTIC THREE-DIMENSIONAL CIRCUIT ELEMENT AND METHOD OF MANUFACTURING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a plastic three-dimensional circuit element, and a method of manufacturing the same which can easily manufacture the circuit element with excellent workability even in a case of forming a three-dimensionally bent or refracted circuit. SOLUTION: This plastic three-dimensional circuit element is formed by filling an electrically conductive material in a hole formed inside a plastic structure by irradiation with a laser beam having a pulse width of 10<-12> sec or shorter. The hole may be formed by irradiating the plastic structure with a laser beam having a pulse width of 10<-12> sec or shorter in a form of either single luminous flux or multiple luminous flux. The method of manufacturing the plastic three-dimensional circuit element is that, after forming the hole by focusing the laser beam of 10<-12> sec or shorter to the inside of the plastic structure, an electrically conductive material is filled in the hole to form the circuit.</p>
申请公布号 JP2003110206(A) 申请公布日期 2003.04.11
申请号 JP20010305221 申请日期 2001.10.01
申请人 NITTO DENKO CORP 发明人 URAIRI MASAKATSU;KATAYAMA SHIGERU;HORIIKE MIKA;HIRAO KAZUYUKI
分类号 B23K26/00;B23K26/38;H05K1/02;H05K3/00;(IPC1-7):H05K1/02 主分类号 B23K26/00
代理机构 代理人
主权项
地址