| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the strength against bending deformation in a card or a tag including an IC module constructed of an IC chip, an antenna coil and the like. SOLUTION: In the vicinity of the IC module, an elastic body having a Shore hardness of 80 or less is arranged as a cushioning material to be sealed in it. When stress is absorbed by the elastic body, the damage of the IC module or a card base material can be reduced greatly. As the elastic body, a woven fabric, a non-woven fabric, an elastomer, a hot-melt adhesive and the like are used.</p> |
