| 摘要 |
PURPOSE: A plating bath and a method for improving deposition of a metal on a substrate by including hydroxylamines in the plating bath that prevent the degradation of plating bath components are provided. CONSTITUTION: The metal plating bath comprising an additive consumption inhibiting compound having formula 1, (R1-NHR2-OH)nX, where R1 and R2 are each independently hydrogen, C1-C6 alkyl, n is 1 or 2, when n is 1, X is HSO4¬-, H2PO4¬-, NO3¬-, F¬-, Cl¬-, Br¬- or I¬- and when n is 2, X is SO4¬2-; and metal salts of copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, nickel, bismuth, indium, tin, rhodium, lead, ruthenium, iridium, or alloys thereof, wherein the C1-C6 alkyl comprises methyl, ethyl, propyl, isopropyl, butyl, isobutyl, sec-butyl, tert-butyl, pentyl, isopentyl, neopentyl, tert-pentyl, hexyl, isohexyl, 3-methylpentyl, 2,2-dimethylbutyl, or 2,3-dimethylbutyl, wherein the additive consumption inhibiting compound comprises hydroxylamine sulfate, hydroxylamine nitrate, hydroxylamine chloride or mixtures thereof, wherein the additive consumption inhibiting compound comprises from about 0.001 g/L to about 100 g/L of the bath, wherein the additive consumption inhibiting compound comprises from about 0.01 g/L to about 20.0 g/L of the bath, and wherein the metal plating bath further comprises additives comprising brighteners, levelers, hardeners, wetting agents, malleability modifiers, ductility modifiers, deposition modifiers, or suppressors.
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