| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that is entirely miniaturized by removing the island section of a lead frame where the semiconductor device has been placed conventionally in the chip-type semiconductor device using the lead frame. SOLUTION: In the semiconductor device 21 that has a semiconductor device 22, a plurality of lead sections 23 that are extended toward the semiconductor device 22, and a resin material 24 for sealing the upper surface of the semiconductor device 22 and the lead section 23, the lead section 23 is extended to the lower-surface side of the semiconductor device 22, the end section of the semiconductor device 22 is placed at an extended tip section 30, and at the same time an element electrode section 25 of the semiconductor device 22 is electrically connected to the lead section 23. |
