| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a thin film removing device for removing a part of a thin film from an upper face, an oblique face, a side face, a lower face or an angular part of a peripheral part of a substrate applying the thin film at high precision and high quality. SOLUTION: The thin film removing device which removes a part of the thin film from the peripheral part of the substrate applying the thin film is provided with a stage 33 for mounting the substrate, a head 1 for discharging a release liquid from sideward of the substrate and sucking the release liquid from upward of the substrate, a removing means 31 or the like for relatively moving the stage and the head, a release liquid feed means 20 for feeding the release liquid to the head, and a release liquid collecting means 26 for collecting the release liquid from the head.</p> |
