发明名称 CIRCUIT SUBSTRATE, AND APPARATUS AND PROGRAM FOR DESIGNING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a circuit substrate which can form a module, the easiness of inspection of which is not different from that in a case of installing ICT (in-circuit tester) pads for all nets and bad influences on the performance caused by installing the ICT pads are small. SOLUTION: A circuit substrate having a plurality of edge terminal for forming a module is designed and manufactured such that ICT pads are formed only for the nets that are not connected to the edge terminals, as shown in (B).
申请公布号 JP2003110212(A) 申请公布日期 2003.04.11
申请号 JP20010305945 申请日期 2001.10.02
申请人 SEIKO EPSON CORP 发明人 TAKAGI EIJI
分类号 G06F17/50;H05K1/02;H05K1/11;H05K3/00;(IPC1-7):H05K1/11 主分类号 G06F17/50
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