| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of forming aerial metal wiring to obtain an aerial wiring structure which can improve joining strength and has sufficient self-standing property. SOLUTION: A temporary supporting layer 2 is formed on a semiconductor substrate 1, this temporary supporting layer 2 has a hole 4 which reaches the semiconductor substrate 1, this hole 4 is filled with a conductive material 5, and the conductive material 5 and the semiconductor substrate 1 can be joined with pressure by pressurizing the conductive material 5.
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