| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems, when a profile of a quartz piece is formed simultaneously with the wet etching work for forming a recess in the quartz piece, of the optimization being difficult because the conditions for forming the recess and for forming the profile are different, further the main surface of the recess bottom has poor surface roughness, the degree of contamination the etching solution is doubled, management of the etching speed being difficult, the available number of the quartz pieces being small because penetrated regions must be provided in individual quartz pieces, the size precision of an electrode formed according to photolithographic technology being poor, and the auxiliary oscillation reduction for stabilizing characteristics having to be carried out while taking productivity into account. SOLUTION: A plurality of recesses are formed simultaneously on a wafer by etching, and then cut into a plurality of quartz pieces. Further, in the etching work, the vicinity to be cut later is beveled at the same time by etching.
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