| 摘要 |
PROBLEM TO BE SOLVED: To set the difference in grounding potentials between circuit substrates to a desired value without changing the wiring substrate itself or changing the method of mounting. SOLUTION: Grounding patterns 47a, 48a for jumper-line connection are respectively formed on first and second connecting edges 44, 45 of a flexible wiring substrate, while the grounding patterns 47a, 48a are mutually connected by a jumper line 60. Through-holes 61-64 are formed in the first and second connecting edges 44, 45, and the jumper line 60 is forced to pass through the through-holes 61-64 to fasten the jumper line 60 to the connecting edges 44, 45 and to wire the jumper line 60 in planes that are different from the planes to which the connector terminal groups 51, 52 are attached so as to escape from the attached plane.
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