发明名称 HEAT DISSIPATION STRUCTURE, PACKAGE ASSEMBLY AND HEAT DISSIPATION SHEET
摘要 PROBLEM TO BE SOLVED: To simplify the inspection work of heat dissipation and to enhance the heat dissipation properties of the housing and the degree of freedom in the design of a heat conduction passage. SOLUTION: The heat dissipation structure comprises heat dissipating bodies 3, 3' and 19 being coupled thermally with a substrate 12 supported in housings 16 and 17, and a sheet 4 for thermally coupling the heat dissipating body 3 and a package 13 bonded to the substrate 12. the sheet 4 has thermal conductivity and flexibility. The flexible sheet 4 can form a heat conduction passage as short as possible in a space where a variety of components are arranged in a crowded fashion in the housing. The GS is effective not only in the heat dissipation test but as an actual product. The sheet 4 is formed of a heat dissipating part 5 being coupled thermally with the heat dissipating bodies 3 and 3', a heat absorbing part 6 being coupled thermally with the package, and a bending part 7 between the heat dissipating part 5 and the heat absorbing part 6. According to the arrangement, the degree of freedom is enhanced in the design of the heat conduction passage.
申请公布号 JP2003110263(A) 申请公布日期 2003.04.11
申请号 JP20010301097 申请日期 2001.09.28
申请人 NEC CORP 发明人 OYAMADA TAKASHI
分类号 G12B15/06;F28D15/02;H01L23/36;H05K7/20;(IPC1-7):H05K7/20 主分类号 G12B15/06
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