| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus which assembles a semiconductor laser more accurately and efficiently by shortening the time required for a welded part between a stem and a semiconductor laser chip to be cooled and solidified. SOLUTION: The bonding apparatus for a semiconductor laser chip is such that the stem 70 set on a heat plate 16 and the semiconductor chip 80 chucked and supported by a nozzle 41 are aligned with each other, and the stem 70 and the semiconductor laser chip 80 are heated and bonded to each other, with the semiconductor laser chip 80 pressed against the stem 70. Around the heat plate 16, a cooling gas emitting member 30 which emits a cooling gas toward the stem 70 and the semiconductor chip 80 after heating the stem 70 and the semiconductor chip 80 to a bonding temperature or above is connected to a cooling gas supply source.
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