发明名称 AIRFOIL SURFACE-MOUNT PACKAGE FOR LIGHT-EMITTING DIODE
摘要 PROBLEM TO BE SOLVED: To improve the reliability of soldering of a surface-mount LED package onto a motherboard. SOLUTION: A metal contact on the bottom of the surface-mount LED is extended broader than an adhesive covering the LED. Owing to the extension, the area for soldering onto the motherboard can be increased.
申请公布号 JP2003110145(A) 申请公布日期 2003.04.11
申请号 JP20020187376 申请日期 2002.06.27
申请人 HARVATEK CORP 发明人 CHO SEIWA;O HEIRYU
分类号 H01L33/50;H01L33/56;H01L33/62 主分类号 H01L33/50
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