发明名称 CIRCUIT BOARD
摘要 <p>PROBLEM TO BE SOLVED: To provide a circuit board that can maintain excellent airtightness in a cavity, and at the same time can improve the insulating properties between conductor films. SOLUTION: In the circuit board, a plurality of dielectric layers 1a to 1g made of ceramic and glass constituents are laminated. At the same time, the circuit board has a laminate 1 having a cavity 2 for accommodating an electronic component element 5 on the main surface, and an internal wiring conductor film using Ag or Cu that is provided among the dielectric layers 1a to 1g as a main constituent. At the same time, one portion of the internal wiring conductor film 3 is extended in the cavity 2 for connecting to the electronic component element 5. An insulating film 4 using glass as the main constituent is included between the internal wiring conductor film 3a extended to the cavity 2 and the dielectric layer ld. Additionally, the insulating film 4 is arranged at a boundary section where the internal wiring conductor film 3 is extended to the cavity 2.</p>
申请公布号 JP2003110244(A) 申请公布日期 2003.04.11
申请号 JP20010298644 申请日期 2001.09.27
申请人 KYOCERA CORP 发明人 SAKANOUE AKIHIRO
分类号 H05K3/46;H01L23/12;H03H9/25;(IPC1-7):H05K3/46 主分类号 H05K3/46
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