| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component wherein the electronic component in a wafer state is taken out with satisfactory efficiency so as to be mounted on a board. SOLUTION: In the electronic component mounting apparatus, a plurality of semiconductor chips 14a are taken out from a wafer holding part 12 so as to be mounted on the board. A mounting head 7 is provided with a plurality of nozzles 8, and it is provided with an ejector mechanism which is provided with a plurality of pins 18a used to push up the plurality of semiconductor chips 14a from their lower parts when the chips are taken out, and by which the plane positions of the pins 18a can be adjusted individually by a fine movement table 17. Consequently, the pins 18a are aligned individually with reference to the plurality of semiconductor chips 14a position-recognized by a component recognition camera, the plurality of semiconductor chips 14a can be pushed simultaneously and collectively, and the plurality of semiconductor chips 14a can be taken out with satisfactory efficiency in the same mounting pattern.</p> |
