| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounted component inspecting method which can perform stable high-speed electronic component mounting position inspection even in case of variance among components and variance in mounting angle. SOLUTION: The mounted component inspecting method for inspecting the mounting states of electronic components (50, 53) having main body parts (51, 54) and electrodes (52, 55) on a substrate 3 mounted with the electronic components (50, 53) has the mounting states such as whether there are the components mounted on the substrate, whether they are mismounted, and the mounting positions of the components are inspected by performing matching processing for an image of the electronic components on the substrate 3 mounted with the electronic components by using a matching plate 24 extracted from an edge 57 of the electrodes (52, 55) except the boundary line 56 between the main bodies (51, 54) and electrodes (52, 55) of the electronic components. |
