| 摘要 |
PROBLEM TO BE SOLVED: To provide a new surface acoustic wave device which allows even comparatively short wires to be looped for connecting an surface acoustic wave chip to pads of a package. SOLUTION: The surface acoustic wave device comprises an intermediate (pillow-like structure) 6 provided between pads 3a, 3b of a package 1 and pads 4a, 4b of a surface acoustic wave chip 2 and wires 5b running over the intermediate 6 to connect the pads 3a, 3b of the package 1 with the pads 4a, 4b of the chip 2. |
